RESPONSIBILITIES:

The role of PDE CEM Manager, works in close collaboration with Assembly Package Technology Development (TD) and Micron Malaysia Backend (MMP) Site teams and is responsible for the effective transfer of new products and packages from the Technology Development teams to MMP. The manager has oversight for the New Product roadmap for MMP and its timely implementation. The success of this position will be assessed by timely execution of new product qualification and package startup within MMP and the ability to ramp the product and package to minimum, predefined yield, quality and reliability targets. Support Micron goal of First Time, One Time, Every Time NPIs success.

Manage and develop Team 

• Identify headcount needs, recruit, interview and make hiring decisions
• Coach and provide career development, identify strengths and create specific development plans for each direct report
• Establish goals, conduct performance appraisals, provide recognition and drive accountability
• Develop and provide technical training to team and groom each member to realize his/her fullest potential

Manage NPI Projects 

• Liaise with APTD, Package design, PE, Test, Process, QRA team on NPI project schedule for Die Bond and Wire Bond Operation
• Understand technical risk and able to push technical envelope whenever possible to design packaging solution that is processable, optimizing quality vs cost and cycle time.
• Perform Technical Risk Assessment on NPI projects. Plan materials, process and equipment selection to mitigate risk. Plan Checkout and FUT to validate process are good to support qualification build
• Perform design, process and material optimizations to ensure robust NPI introduction
• Schedule 1st Si, engineering samples and qualification build. Plan resources to ensure smooth execution
• Resolve technical challenges and perform root cause analysis on any quality and reliability issues encountered during the various builds
• Drive technical development of the engineers
• Maintain the product realization workflow and documents checkout, FUT, qualification reports to meet TS certification

Technology Transfer

• Work with Technology Development team to understand new technology challenges and adapt technology to support new product NPI
• Understand the TD POR, TOR and BOM and adapt or make necessary changes to support NPI

HVM transfer

• Document lessons learnt from NPI start-up. Define NPI POR, TOR and BOM to support fan-out to HVM
• Work with planning, capacity and production to hand hold the first LVM production and ensure smooth transfer into HVM
• Ensure a smooth ramp-up without quality issue related to product, met all the HVM metrics goal during LVM

REQUIREMENTS:

• Bachelor’s Degree in Engineering
• Minimum 2-3 years supervisory experience in Backend Semiconductor Manufacturing, experienced in leading NPI qual success and sample on time delivery. Equipped with advance package know-how (process engineering or material engineering knowhow)
• Good knowledge of data analysis, process characterization, problem solving and management skill.
• Knowledgeable in IC Packaging Assembly Process Flow.
• Independent with good communication and co-ordination skills.
• Great team work within the team and cross functional team