The Allegro team is passionate about providing intelligent solutions that move the world toward a safer and more sustainable future. With more than 30 years of experience developing advanced semiconductor technology, innovation with purpose touches every aspect of our business.  From customer engagement and employee recognition to technology advancement and serving the local communities in which we maintain offices, innovation consistently drives our mission and definition of success. 

JOB RESPONSIBILITIES:

• Process Set-up and Development, Parameter Optimization by experimental designs, process variable definitions and robust design engineering for continuous improvement.
• Conceives, sources out and tests alternative and new methods/processes to improve manufacturability, yield and quality. Spearheads generation of FMEA for new Assembly processes and review of existing FMEA.
• Designs and/or qualifies jigs, fixtures, and tools to enhance machine efficiency and improve product quality. Generates and/or reviews equipment specifications and qualification procedures, and supporting documents for PAR of new equipment.
• Sources out, evaluates and recommends alternative materials to reduce cost, enhance quality, and improve manufacturability.
• Determines machine and process capability for new products. Ensures that engineering lots for new devices and packages are assembled in conformance to all requirements and process concerns are reported. Plans, designs, implements and monitors activities geared to improve product and material yield, reduce production cost and/or reduce product reliability defects.
• Generates, interprets, and updates process and material specifications and flowcharts for all the in-house assembly operations and products. Interprets quality inspection criteria and specifications.

MINIMUM REQUIREMENTS:

• Degree in Electrical / Electronics and Communication / Mechanical / Materials / Metallurgical / Chemical / Manufacturing / Industrial Engineering
• At least 3 years experience in the same capacity in a semicon setting
• Can generate technical reports and define manufacturing specifications
• Can apply core tools (APQP, FMEA, MSA, SPC, PPAP)
• High level of experience and considered to be a subject matter expert (SME) in Die Prep, Die attach and Wirebond process.