Posted:
10/1/2024, 7:58:05 AM
Location(s):
Maryland, United States ⋅ Baltimore, Maryland, United States
Experience Level(s):
Junior ⋅ Mid Level ⋅ Senior
Field(s):
Mechanical Engineering
Northrop Grumman Mission Systems is seeking a Microelectronics Material and Process Specialist to join its team within the Mission Systems Organization. This position is located in Linthicum, Maryland.
PRIMARY FUNCTION:
Assist engineers in the facility to perform processes for the development and production of a variety of modules and assemblies built in the AMEC facility using a variety of process equipment and materials.
WORKING PROCEDURE AND/OR RESPONSIBILITY ASSIGNED:
PERFORM WORK OF EQUAL OR LOWER SKILL LEVEL AS REQUIRED.
Set up and run complex process equipment including but not limited to: auto-wire/wedge bonding, component placement, rework, sikama, manual wire and wedge bonding.
Train/guide other microelectronics material and process specialists and EMS personnel.
Maintain process documentation required in the microelectronic and assemblies built in the AMEC facility.
Assist engineering in the development and implementation of process improvements.
Make recommended process improvements to engineering.
Set-up and operate a variety of advanced automatic/manual manufacturing and special research equipment with limited instruction and guidance from engineering or higher classified microelectronics material and process specialists.
Successfully complete all required training courses.
Capture required process data, analyze and make recommendation to engineering.
This is an SEA Union represented position.
This is a 5th Shift position.
EDUCATION REQUIREMENT:
High school graduate or equivalent. Must possess a minimum of (6) college credits in a laboratory science such as a chemistry or physics, computer science, or a related technical field. Military equivalent will be accepted.
EXPERIENCE REQUIREMENT:
Experience in a manufacturing and or laboratory environment OR college or military coursework in a related technical field.
PREFERRED QUALIFICATIONS:
1+ years as a chip mount or wire bond operator, mechanically inclined.
The application period for the job is estimated to be 20 days from the job posting date. However, this timeline may be shortened or extended depending on business needs and the availability of qualified candidates.Northrop Grumman is committed to hiring and retaining a diverse workforce. We are proud to be an Equal Opportunity/Affirmative Action Employer, making decisions without regard to race, color, religion, creed, sex, sexual orientation, gender identity, marital status, national origin, age, veteran status, disability, or any other protected class. For our complete EEO/AA and Pay Transparency statement, please visit http://www.northropgrumman.com/EEO. U.S. Citizenship is required for all positions with a government clearance and certain other restricted positions.Website: https://northropgrumman.com/
Headquarter Location: Falls Church, Virginia, United States
Employee Count: 10001+
Year Founded: 1994
IPO Status: Public
Last Funding Type: Grant
Industries: Data Integration ⋅ Manufacturing ⋅ Remote Sensing ⋅ Security ⋅ Software