Posted:
3/11/2025, 5:00:00 PM
Location(s):
Hsinchu, Hsinchu City, Taiwan ⋅ Hsinchu City, Taiwan
Experience Level(s):
Junior ⋅ Mid Level ⋅ Senior
Field(s):
Software Engineering
Position Description:
The candidate will focus on Chip + IC Packaging + Board space. The candidate will work with customers to deeply understand their requirements, and discuss these with the factory to develop the required software.
Position Requirements:
o Fluent in one of the following:
- C/C++
- Java
o Strong background in one of the following:
- Computational Geometry
- Artificial Intelligence (Placement, Routing, or Design Optimization)
o Knowledgeable in UNIX and Windows
o Knowledgeable in Electronic Device Nomenclature
o Ability to work individually or with a small distributed team
o Ability to interact professionally with the customer
o Ability to communicate in English
Website: https://www.cadence.com/
Headquarter Location: San Jose, California, United States
Employee Count: 5001-10000
Year Founded: 1988
IPO Status: Public
Industries: Aerospace ⋅ Electronic Design Automation (EDA) ⋅ Hardware ⋅ Mobile ⋅ Semiconductor ⋅ Software