Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR52347 Package Design Engineer or Senior Package Design Engineer

Responsibilities include, but are not limited to the following:

• Support die padlog layout/optimization.
• Support design of highly integrated packages using advanced BEOL and RDL flows for optimal electrical performance, manufacturability, and reliability. Work with customers, internal process design teams, OSATs, and other ecosystem partners.
• Support set up of designs, rules, and routing methodologies for advanced processes.
• Support package and DFMEA reviews with assembly engineering and subcon teams.
• Generate and update assembly documents in database. Provide drafting and drawing support for package drawings, interposer drawings, and manufacturing drawings.
• Work with SBT (Printed Circuit Board) suppliers, OSATs (Outsourced Semiconductor Assembly and Test), and other ecosystem partners to meet their requirements with packaging solutions.
• Work closely with architects, semiconductor design leads and package design leads from the initial stages of chip development to optimize die floorplan, interconnection scheme, and package designs for the best system performance.
• Conduct feasibility studies for various package options and assess designs for manufacturability and reliability.
• Lead package and DFM (Design for Manufacturing) reviews and design setup.
• Engage with key Business Unit (BU) stakeholders and assembly subcontractor partners to propose package solutions that meet customer and/or market needs.
• Support package technology development, including material selection, process development, DOEs (Design of Experiments), and related activities.
• Track and drive program milestones to ensure timely development execution.
• Support packaging IP (Intellectual Property) development.
• Provide design support for thermal/mechanical/electrical simulation analysis.
• Support and contribute to the design group’s continuous improvement efforts such as:
  • Global design alignment activities
  • Package design rules and system development
  • Package roadmaps
  • Competitive Analysis review

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at [email protected].

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.