<New Graduate Hiring> Marking Process Engineer

Posted:
7/19/2026, 2:03:27 AM

Location(s):
Kaohsiung, Taiwan

Experience Level(s):
Junior ⋅ Mid Level

Field(s):
Mechanical Engineering

Workplace Type:
On-site

Pay:
$151k/yr

Responsibilities:

•Process engineer include Molding and Laser Marking process. Well-known Assembly front-end & back-end process is preferred.

•Focus on process maintenance and improvement, new technology development, and continues yield improvement.

•Collaboration with related departments including internal or external.

Qualifications:

•Bachelor or Master's degree, major in Mechanical or Material Engineering or other related disciplines

•Seniority less than 2 years.

•Ability to speak and write in English fluently.

•Good communication (Chinese and English) and emotion management..

•Learning, innovation, fast-paced, and teamwork.

More information about NXP in Greater China...

#LI-2370

NXP Semiconductors

Website: https://www.nxp.com/

Headquarter Location: Eindhoven, Noord-Brabant, The Netherlands

Employee Count: 10001+

Year Founded: 2006

IPO Status: Public

Last Funding Type: Post-IPO Debt

Industries: Apps ⋅ Automotive ⋅ Energy Efficiency ⋅ Information Technology ⋅ Manufacturing ⋅ Mobile ⋅ News ⋅ Semiconductor ⋅ Software ⋅ Video

Visa Sponsorship: Sponsors work visas

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