Sensor Package Design Engineer

Posted:
7/29/2024, 10:33:28 AM

Location(s):
San Francisco, California, United States ⋅ California, United States

Experience Level(s):
Mid Level ⋅ Senior

Field(s):
Mechanical Engineering

Workplace Type:
On-site

We are looking for a Sensor Packaging Development and Production Engineer to design and develop our IC packaging solutions. We are seeking an adaptable, well-organized engineer who can work between hardware, systems, IC and operations to drive our packaging development. The role is San Francisco based and will include some travel.

Ouster

Website: https://ouster.com/

Headquarter Location: San Francisco, California, United States

Employee Count: 251-500

Year Founded: 2015

IPO Status: Public

Last Funding Type: Debt Financing

Industries: Autonomous Vehicles ⋅ Electronics ⋅ Industrial Automation ⋅ Manufacturing ⋅ Robotics ⋅ Sensor

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