Job Details:

Job Description: 

This position requires candidates to upload a resume in English; you are welcome to upload multiple versions of your resume if you prefer but an English version of your resume will be required to be considered for this position.

We are seeking a dynamic individual to join the DCG's Cloud and AI System HW team (CASH) team as a Thermal Intern. This individual will be part of a larger a cross functional Architecture/Engineering team (i.e. Board/ System, Mechanical, Thermal, SI/PI/PD, etc.) responsible for Co-Engineering Custom Design Systems with strategic customers.

Additionally, this person will be a contributor in CASH's Thermal/Mechanical Center of Excellence (CoE) - defining/driving/bringing to market new platform level innovations and solutions that:

• Proactively addresses Thermal/Mechanical issues our CSPs face.
• Integrate Intel's Adjacent Technologies/Solutions (i.e., Networking, MCR, AI/Machine Learning, etc.).
• Drive new thermal innovations that push next level performance within the CSP's environment.

Responsibilities will include but not be limited to:

• Support thermal engineers with lab testing, data collection, and documentation.
• Assist with thermal modeling setup and review of simulation results.
• Help analyze airflow and temperature data.
• Document assumptions, results, and identified risks.

Soft Skills:

• Self-learner with the ability to independently acquire new technical skills and concepts.
• Curiosity and willingness to learn.
• Follow technical instructions and ask clarifying questions.
• Comfortable working in a cross-functional engineering environment

  

Intern must be willing to work at least 30 hours per week.

Qualifications:

Minimum qualifications and technical skills are required to be initially considered for this position.  Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates.

Requirements listed would be obtained through a combination of industry relevant job experience, internship experiences and or schoolwork/classes/research.

Minimum Qualifications:

• Pursuing a Bachelor's degree in Mechanical Engineering, Chemistry Engineering, Mechatronics, or equivalent field.
• 6 months of experience in:
  • Heat transfer, thermal engineering, and test/validation techniques of said solutions.
  • Analyze and present data using Microsoft Excel.
  • Document results clearly using PowerPoint and Word.
  • Basic familiarity with CAD tools such as Creo, SolidWorks, or NX.
• Advanced English level.
• Must have unrestricted, permanent right to work in Mexico (this role is not eligible for visa or immigration sponsorship)

Preferred Qualifications:

• Academic or project experience with air-cooled or liquid-cooled thermal solutions.
• Exposure to heat sinks, cold plates, heat pipes, or electronics cooling concepts.
• Basic exposure to thermal simulation tools (ANSYS, Icepak, FloTHERM, or similar).
• Experience with lab testing or experimental setups is a plus.
• Basic experience with Python or MATLAB for data analysis or scripting.
• Familiarity with post-processing thermal or airflow data.

          

A candidate who accepts an offer of employment in Mexico is required to present their own personal identification information and numbers for the following: Mexican Security Number (NSS), Tax Identification Number (RFC) and CURP identification number.

          

Job Type:

Student / Intern

Shift:

Shift 1 (Mexico)

Primary Location: 

Mexico, Guadalajara

Additional Locations:

Business group:

At the Data Center Group (DCG), we're committed to delivering exceptional products and delighting our customers. We offer both broad-market Xeon-based solutions and custom x86-based products, ensuring tailored innovation for diverse needs across general-purpose compute, web services, HPC, and AI-accelerated systems. Our charter encompasses defining business strategy and roadmaps, product management, developing ecosystems and business opportunities, delivering strong financial performance, and reinvigorating x86 leadership. Join us as we transform the data center segment through workload driven leadership products and close collaboration with our partners.

Posting Statement:

All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.

Position of Trust

N/A

Work Model for this Role

This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.

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ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.