Posted:
5/11/2026, 7:40:27 PM
Location(s):
Kedah, Malaysia ⋅ Penang, Malaysia
Experience Level(s):
Mid Level ⋅ Senior
Field(s):
Mechanical Engineering
Workplace Type:
On-site
Seeking a highly motivated, self-driven individual in ATD-Asia with strong technical background and ability to collaborate well across multi-functional teams driving materials technology development in packaging.
Candidate will be responsible for leading efforts to develop, integrate, and certify materials in support of assembly packaging development and HVM readiness for Intel's Packaging Technologies.
Candidate will be expected to communicate and influence materials and supplier directions, strategies, and decisions.
The candidate should have a solid understanding of the fundamentals of materials (polymers, metals, solders, composites, etc.), physical and mechanical properties, structure-property-processing relationships, analytical tools and characterization techniques, mechanical behavior and modeling, thermodynamics and kinetics, and phase transformations, etc.
Candidate must be able to apply sound technical problem-solving skills in resolving materials-process-equipment issues in technology development.
Specific responsibilities include planning and executing programs for evaluating new material and supplier technologies, conducting material/supplier technology assessments, and making material/supplier technology recommendations/certifications to platform programs.
Candidate is expected to work in close collaboration with MTD and ME teams in ATD along with Global materials, Core competency, Q and R, and Technology Integration partners.
Candidate must be able to work with external materials suppliers, should possess effective communication and presentation skills with ability to formulate and present materials strategies and development plans in internal and external forums.
Demonstrated project and team management skills, communication and presentation skills, negotiation skills, and well developed influencing skills are a must.
Travel to materials, suppliers, and assembly sites is required.
Minimum Qualifications:
Ph.D. degree in Materials Science and Engineering, Chemical Engineering, Chemistry, or Metallurgy with excellent understanding of materials characterization tools and techniques
Min 5 years experience in materials development, with strong understanding of Packaging assembly materials-process-equipment integration, materials supplier management is highly desired.
Effective communication skills with ability to closely collaborate across multiple teams and sites is required.
Preferred Qualifications:
Knowledge of statistical methods, Design of Experiments knowledge is a strong plus.
8+ year in semiconductor industry
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.*
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.Website: https://www.intel.com/
Headquarter Location: Santa Clara, California, United States
Employee Count: 10001+
Year Founded: 1968
IPO Status: Public
Last Funding Type: Post-IPO Equity
Industries: Artificial Intelligence (AI) ⋅ Information Technology ⋅ Product Design ⋅ Semiconductor ⋅ Software