Our vision is to transform how the world uses information to enrich life for all.

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

JR62603 Sr. Engineer, Packaging Technology Development and Integration

Job Responsibilities:

Ensure smooth transition from new process development, 1st qualification success to small volume production launch

Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode (NPI) requirements and schedule

Perform process TRA, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate.

Lead/collaborate with cross function team/site, to ensure successful transfer to CEM for LVM.

Qualify new process/technology/equipment/materials

Implement PMI (Process Maturity Index) methodology & provide proper Documentation for product transfer CEM & HVM

Technical capability

Identify path finding opportunities for continuous yield improvement and cost reduction activities

To understand and be able to integrate process knowledge between upstream and downstream across Si and assembly/packaging process

Understand the future trend, technology and capabilities required for future packaging solutions, work with teams to put in place new capabilities to enhance process performance.

Provide new solutions on time to meet company and customer needs

Define, develop and establish process capabilities, strategy and roadmap

To develop & engage creative solutions for new capabilities or to overcome the identified process constraints, ahead product requirements.

Job Requirements:

PhD/Masters/Bachelor’s Degree in Electrical & Electronic, Material, Mechanical Engineering, Physics & Applied Physics or Equivalent Work Experience Required

2 years' experience in semiconductor industry

Experience in Frontend fab Process integration or Module process with technical knowledge on wafer and die level process technology

Understanding of Micron’s silicon and how it interacts at backend process & package level through CPI is a plus

Strong project management skills to ensure execution to timelines

Strong communication and presentation skills

Understanding of business needs and customers’ requirement

Ability to integrate & cooperate with people from cross function teams

About Micron Technology, Inc.

We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.

To learn more, please visit micron.com/careers

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.

To request assistance with the application process and/or for reasonable accommodations, please contact at [email protected].

Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.

Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.